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65 Hari Vignesh Ramasamy, et al. Yun-Sung Lee, Atomic layer deposition of Al2O3 on P2-Na0.5Mn0.5Co0.5O2 as interfacial layer for high power sodium-ion batteries, Journal of Colloid and Interface Science Volume 564, 22 (2020), 467-477
64 Tae-Gun Kim et al., Supersonically sprayed iron oxide nanoparticles with atomic-layer-deposited ZnO/TiO2 layers for solar water splitting, Journal of Alloys and Compounds 798 (2019) 35-44
63 Jun Beom Kim et al., Atomic layer deposition of WNx thin films using a F-free tungsten metalorganic precursor and NH3 plasma as a Cu-diffusion barrier, Thin Solid Films 685 (2019) 393–401
62 Rohit D. Chavan et al., Atomic Layer Deposition of an Effective Interface Layer of TiN for Efficient and Hysteresis-Free Mesoscopic Perovskite Solar Cells, ACS Appl. Mater. Interfaces 2020, 12, 8098−8106
61 Mohd Z. Ansari et al., Enhanced activity of highly conformal and layered tin sulfde (SnSx) prepared by atomic layer deposition (ALD) on 3D metal scafold towards high performance supercapacitor electrode, Nature (2019) 9:10225
60 Jae-Hun Kim et al., Enhancement of CO and NO2 sensing in n-SnO2-p-Cu2O core-shell nanofibers by shell optimization, Journal of Hazardous Materials 376 (2019) 68–82
59 Sang Hyun Yoon et al., Insertion of an Inorganic Barrier Layer as a Method of Improving the Performance of Quantum Dot Light-Emitting Diodes, ACS Photonics 2019, 6, 743−748
58 Pavan Pujar et al., High-Intensity Ultrasound-Assisted Low-Temperature Formulation of Lanthanum Zirconium Oxide Nanodispersion for Thin-Film Transistors, ACS Appl. Mater. Interfaces 2020, 12, 40, 44926–44933
57 Hyeong-Rae Kim, Ji-Hee Yang, Gi-Heon Kim, and Sung-Min Yoon, Flexible vertical-channel thin-film transistors using In-Ga-Zn-O active channel and polyimide spacer on poly(ethylene naphthalate) substrate, J. Vac. Sci. Technol. B 37(1), Jan/Feb 2019
56 Seung-Min Han, Dip K. Nandi, Yong-Hwan Joo, T. Shigetomi, K. Suzuki, S. Nabeya, R. Harada, and Soo-Hyun Kim, Atomic layer deposition of high-quality Pt thin film as an alternative interconnect replacing Cu, J. Vac. Sci. Technol. A 38(3) May/Jun 2020