NCD

NCD has recently contracted with Samsung Electronics Co., Ltd. to supply ALD cluster system for semiconductor process. This system is ALD equipment consisting of 3 ALD process
modules (PMs) and a wafer transfer module (TM) for oxide and metal deposition with
Ozone and Plasma process. Also it will be able to process at high temperature up to 500℃ because of consisting of a high temperature process dual chamber and apply running
program for process integration for various material depositions among multi process
chambers continuously.
This supplied ALD equipment has been designed and manufactured with NCD’s originated technologies. NCD expects that the system will contribute very much to the development
of new high-end semiconductor technology and technology fusion.
NCD will do all of efforts to be the best ALD equipment company with continuous R&D.