Global Leader in ALD Technology
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- Lucida™ M series ALD
LucidaTM M series ALD
Plasma enhanced atomic layer deposition system for R&D applications
LucidaTM M series ALD
Applications
- Thin film process for PEALD research
- Applications of R&D
- Very low price
- Various additional option
Features
- PEALD thin films with good thickness uniformity and conformal step coverage
- Advanced process kit and minimized gas supply line length for short cycle times
- Direct plasma system
- Totally integrated process module
- Easy process control
- Load-lock system
Technical Specifications
| Substrate Size | 150~300 mm |
|---|---|
| Substrate Temperature | 25℃ ~ 450 ℃ (± 0.2 ℃) @ 1Torr, in wafer |
| Precursor Sources | 3, heated 2 sources |
| Deposition Uniformity | <±2% |
| Footprint | 2600(L) x 650(W) x 1500(H) mm(include MTB) |
| Deposition Mechanism | Dual shower-head type |
| Compatibility | Clean room class 100 |
| Control System | PLC/PC control base (full auto) |
| Optional | Up to 4 heated sources |
| Optional | Lucida cooler(2ch) |