Plasma enhanced atomic layer deposition system for
R&D applications |
Applications |
- Thin film process for PEALD research
- Applications of R&D
- Very low price
- Various additional option
|
Features |
- PEALD thin films with good thickness uniformity and
conformal step coverage
- Advanced process kit and minimize gas supply line length for short cycle times
- Direct plasma system
- Totally integrated process module
- Easy process control
- Load-lock system
|
Technical specifications |
Substrate size |
150~300 mm |
Substrate temperature |
25℃ ~ 450 ℃ (± 0.2 ℃) @ 1Torr, in wafer |
Precursor sources |
3, heated 2 sources |
Deposition uniformity |
<±2% |
Footprint |
2600(L) x 650(W) x 1500(H) mm(include MTB) |
Deposition mechanism |
Dual shower-head type |
Compatibility |
Clean room class 100 |
Control system |
PLC/PC control base (full auto) |
Optional |
Up to 4 heated sources |
Optional |
Lucida cooler(2ch) |
|