PRODUCTSR&DLucida™ M series ALD
Lucida™ M series ALD
Plasma enhanced atomic layer deposition system for
R&D applications
  • Thin film process for PEALD research
  • Applications of R&D
  • Very low price
  • Various additional option
  • PEALD thin films with good thickness uniformity and
    conformal step coverage
  • Advanced process kit and minimize gas supply line length for short cycle times
  • Direct plasma system
  • Totally integrated process module
  • Easy process control
  • Load-lock system
Technical specifications
Substrate size 150~300 mm
Substrate temperature 25℃ ~ 450 ℃ (± 0.2 ℃) @ 1Torr, in wafer
Precursor sources 3, heated 2 sources
Deposition uniformity <±2%
Footprint 2600(L) x 650(W) x 1500(H) mm(include MTB)
Deposition mechanism Dual shower-head type
Compatibility Clean room class 100
Control system PLC/PC control base (full auto)
Optional Up to 4 heated sources
Optional Lucida cooler(2ch)
More information for application and specification for Lucida™ M series