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게시판
No
Subject
Date
17
SNEC 2019 EXHIBITION(6/4~6/6, SHANGHAI) BOOTH NO.: N3 #655
05-20
16
Hydrogen diffusion barrier using thermal ALD Al2O3 encapsulation for IGZO TFTs
09-06
15
High device performance of unique ALD-IGZO TFTs to look forward to expanding application area to semiconductor
10-11
14
New contract to supply vacuum roll to roll equipment for Graphene
10-23
13
Improvement of the quantum efficiency of micro LED by ALD passivation
11-06
12
Metal mask coating by ALD for reliable plasma process in PECVD
01-13
11
NCD supplied two Lucida M300 ALD systems for R&D to KANC
03-27
10
NCD contracted with Samsung Electronics Co., Ltd. to supply Lucida M200PL-C ALD System
04-27
9
Thermal ALD IGZO Properties for LTPO TFTs
05-21
8
Future foldable and flexible Display with NCD’s ALD encapsulation technology
08-03
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