Global Leader in ALD Technology

  • 메인
  • PRODUCTS
  • R&D
  • Lucida™ M series ALD

LucidaTM M series ALD

Plasma enhanced atomic layer deposition system for R&D applications

LucidaTM M series ALD

Lucida GS Series

Applications

  • Thin film process for PEALD research
  • Applications of R&D
  • Very low price
  • Various additional option

Features

  • PEALD thin films with good thickness uniformity and conformal step coverage
  • Advanced process kit and minimized gas supply line length for short cycle times
  • Direct plasma system
  • Totally integrated process module
  • Easy process control
  • Load-lock system

Technical Specifications

Technical Specifications
Substrate Size 150~300 mm
Substrate Temperature 25℃ ~ 450 ℃ (± 0.2 ℃) @ 1Torr, in wafer
Precursor Sources 3, heated 2 sources
Deposition Uniformity <±2%
Footprint 2600(L) x 650(W) x 1500(H) mm(include MTB)
Deposition Mechanism Dual shower-head type
Compatibility Clean room class 100
Control System PLC/PC control base (full auto)
Optional Up to 4 heated sources
Optional Lucida cooler(2ch)
More information for application and specification for Lucida™ M series